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Hanmi Semiconductor

🇰🇷 South Korea · Semiconductor equipment · 042700.KS

Chip-packaging equipment, notably HBM thermal-compression bonders.

Market capitalization

USD 8.7B
2025
+61.9%
2024→2025
2020USD 810M
2021USD 1.6B
2022USD 880M
2023USD 4.6B
2024USD 5.4B
2025USD 8.7B

Source: companiesmarketcap.com — Hanmi Semiconductor

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